인쇄 회로판에 관해서 너는 얼마나 통용되는 표준을 알고 있느냐
2020-11-09
Using the difference in the absorption rate of different substances to X-rays, fluoroscopy the parts that need to be tested and find defects. It is mainly used to detect defects in ultra-fine pitch and ultra-high-density circuit boards, as well as bridging, missing chips, poor alignment and other defects generated during the assembly process. It can also use its tomographic imaging technology to detect internal defects in IC chips. It is the only way to test the soldering quality of the ball grid array and the blocked solder balls. The main advantage is the ability to detect BGA welding quality and embedded components, without fixture cost; the main disadvantages are slow speed, high failure rate, difficulty in detecting reworked solder joints, high cost, and long program development time. This is a relatively new test. The method remains to be further studied.
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