밀리미터파 PCB 기판용 Panasonic R5515 사양

Panasonic 밀리미터파 안테나 기판에 적합한 할로겐 프리 초저전송 손실 PCB 기판 (모델:R-5515)을 개발했으며, 열경화성 수지로 업계 최고의 저전송 손실을 달성합니다.  

ADAS (advanced driving support system) 및 자동조종장치가 개발되면서 밀리미터파 레이더는 이러한 시스템을 지원하는 센싱 기술로 사용됩니다. 밀리미터파 송수신기용 안테나 기판의 경우, 낮은 전송 손실이 필요합니다. 지금은 안테나 PCB의 기판으로는 불소계 기판이 주로 사용되고 있습니다. 하지만 수지의 특성상 기판 가공이 어렵고 비용이 많이 든다. 이번에 파나소닉의 수지 설계 기술과 저공비화 동박 결합 기술을 통해 저공비화 및 가공성이 뛰어난"할로겐 프리 초저공비화 전송손실 기판 소재"를 실현했다.  

Characteristics of Panasonic R5515

Characteristics of Panasonic R5515

1. transmission loss: 0.079db/mm (@79ghz), low transmission loss, which can be used for high efficiency and low loss of millimeter wave antenna

From the point of view of processability and cost of antenna substrate, the market demand can replace the substrate material with high versatility which is the mainstream fluorine substrate. Through the exclusive resin design technology and low coarsening copper foil bonding technology, the company has developed a substrate material which can realize the lowest transmission loss in thermosetting resin. Through the same low transmission loss as fluororesin substrate, it contributes to the high efficiency and low loss of millimeter band antenna.

2. excellent PCB processability can reduce PCB processing cost

The PCB base material of PTFE is difficult to be drilled and copper plated in PCB. The loose r5515 is thermosetting resin material, and can be processed by PCB general equipment.

Due to the characteristics of the resin, it is difficult to drill holes and copper plating in the manufacture of fluororesin substrate. Because special manufacturing equipment is needed, the cost is too high. As this material is a thermosetting resin material, it can be easily processed by using the existing equipment for the general substrate. Therefore, the material can replace the fluororesin substrate material and contribute to reduce the processing cost of the substrate.

3. it can be used to process mixed pressure PCB with general FR4

Because the Panasonic R5515 is a thermosetting resin material, it is easier to form at the same time as FR4.

With the development of miniaturization and low cost of millimeter wave band module, the multi-layer requirements of antenna integrated module substrate are higher and higher. Because the fluororesin substrate material is thermoplastic resin, it is difficult to form at the same time with glass epoxy substrate material of thermosetting resin, so it is difficult to realize multilayer. As this material is thermosetting resin material, it is easier to form at the same time with glass epoxy substrate material, which contributes to the multi-layer and cost reduction of antenna integrated module substrate.

Application of Panasonic r5515

Millimeter wave antenna PCB (PCB base material for antenna of vehicle millimeter wave radar and wireless communication base station), high speed PCB transmission.