절연 테플론 wowen glass fabric 카퍼적층 F4T-1/2

Dimensions（mm）

150×150       220×160    250×250     200×300

For   special dimensions, customized lamination is available.

Thickness   and tolerance

0.5±0.05      1±0.1      1.5±0.15      2±0.2      3±0.3

Plate   thickness includes the copper thickness. For special dimensions, customized   lamination is available.

Mechanical   properties

Angularity

0.02mm/mm   for double-layer board

Cutting/   punching property

No   burrs after cutting, and the minimum space between two punching holes is   0.55mm.

Peel   strength

In   normal state:≥18N/cm; In the environment of constant humidity and   temperature:≥6 N/cm .

Chemical   properties

The   chemical etching method for PCB can be used for the circuit processing, the   dielectric properties of materials are not changed.

Electrical     properties

Names

Test   conditions

Unit

Specifications

Gravity

Normal   state

g/cm3

2.2～2.3

Water   absorption rate

Dip   in distilled water of 20±2℃ for 24 hours.

%

≤0.01

Operating   temperature

high-low   temperature chamber

℃

-100～+150

Thermal   conductivity coefficient

Kcal   /m .h.℃

0.4

Coefficient   of thermal expansion

Temperature   rise of 96℃ per hour

×1

9.8～10×10-5

Shrinkage   factor

Two   hours in boiling water

%

0.0005

Surface   insulation resistance

500V   DC

Normal   state

M.Ω

≥1×107

Constant   humidity and temperature

≥1×105

volume   resistance

Normal   state

MΩ.cm

≥1×1010

Constant   humidity and temperature

≥1×107

Pin   resistance

500V   DC

Normal   state

MΩ

≥1×105

Constant   humidity and temperature

≥1×105

Surface   dielectric strength

Normal   state

δ=1mm(kV/mm)

≥1.5

Constant   humidity and temperature

≥1.4

Permittivity

10GHZ

εr

2.           2.2（±2%）

Dielectric   loss angle tangent

10GHZ

tgδ

≤1×10-3